Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10217557 | Laminated inductor | Takayuki Arai, Akiko Yamaguchi, Shinsuke Takeoka, Kazuhiko Oyama, Kenji Otake | 2019-02-26 |
| 10166749 | Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly | Tadatomo Suga, Akira Yamauchi, Yoshiie Matsumoto | 2019-01-01 |