YH

Yu-Tseng Hsien

TSMC: 1 patents #1,597 of 3,065Top 55%
📍 Tongxiao, TW: #1 of 4 inventorsTop 25%
Overall (2019): #206,773 of 560,194Top 40%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10346576 Electromigration sign-off methodology Chin-Shen Lin, Ching-Shun Yang, Jui-Feng Kuan 2019-07-09