Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522427 | Techniques providing semiconductor wafer grouping in a feed forward process | Yh-Hsiu Hsiao, Lu Cheng-Ta, Jian Wu | 2019-12-31 |
TC
Tsun-Jen Chan
Overall (2019): #235,678 of 560,194Top 45%
1
Patents 2019