Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461088 | Method for forming semiconductor device structure | Ching-Yen HSAIO, Cheng-Ming Wu, Chien-Hsian Wang | 2019-10-29 |
| 10283604 | Contact structure for high aspect ratio and method of fabricating the same | Szu-Hsien Lu, Hung-Che Liao, Kun-Tsang Chuang, Yu-Chu Lin, Jyun-Guan Jhou | 2019-05-07 |