Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510637 | Devices and methods for heat dissipation of semiconductor integrated circuits | Chung-Chieh Yang, Yung-Chow Peng, Chung-Peng Hsieh | 2019-12-17 |
| 10289777 | Integrated circuit designs based on temperature distribution determination | Szu-Lin Liu, Jaw-Juinn Horng, Fu-Lung Hsueh | 2019-05-14 |