Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431423 | Method of fabricating an integrated circuit with a pattern density-outlier-treatment for optimized pattern density uniformity | Cheng-Hung Chen, Pei-Yi Liu, Wen-Chuan Wang, Shy-Jay Lin, Burn Jeng Lin | 2019-10-01 |
| 10359695 | Method of fabricating an integrated circuit with non-printable dummy features | Cheng-Hung Chen, Pei-Yi Liu, Wen-Chuan Wang, Shy-Jay Lin, Burn Jeng Lin | 2019-07-23 |
| 10170276 | Method of fabricating an integrated circuit with a pattern density-outlier-treatment for optimized pattern density uniformity | Cheng-Hung Chen, Pei-Yi Liu, Wen-Chuan Wang, Shy-Jay Lin, Burn Jeng Lin | 2019-01-01 |