Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510563 | Wafer carrier assembly | Ming-Tung Wu | 2019-12-17 |
| 10350726 | Chemical mechanical polishing system and method | Chin-Wei Liang, Yen-Chang Chu | 2019-07-16 |
| 10304903 | Semiconductor structure | Harry-Hak-Lay Chuang, Kuei-Hung Shen, Cheng-Yuan Tsai, Ru-Liang Lee | 2019-05-28 |
| 10181441 | Through via structure and manufacturing method thereof | Cheng-Tai Hsiao | 2019-01-15 |