Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269699 | Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics | Wei Ma, Kvei-Feng Yen, Yao-Bin Wang | 2019-04-23 |
| 10262989 | ESD protection for 2.5D/3D integrated circuit systems | Chia-Hui Chen | 2019-04-16 |