CL

Chin Kun Lan

TSMC: 1 patents #1,597 of 3,065Top 55%
Overall (2019): #511,737 of 560,194Top 95%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10510586 Multi-layer structure having a dense middle layer Joung-Wei Liou 2019-12-17