Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522468 | Interconnect structure and method | Chun-Te Ho, Ming-Chung Liang, Chien-Han Chen | 2019-12-31 |
| 10290535 | Integrated circuit fabrication with a passivation agent | Chun-Te Ho, Shih-Yu Chang, Da-Wei Lin, Ming-Chung Liang | 2019-05-14 |
| 10269700 | Interconnect structure and method of forming the same | Ming-Chung Liang | 2019-04-23 |