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Chia-Ping Lai

TSMC: 2 patents #984 of 3,065Top 35%
Overall (2019): #184,763 of 560,194Top 35%
2
Patents 2019

Issued Patents 2019

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10276530 Laterally extended conductive bump buffer Yu-Hsiang Tsai, Hsin-Hung Chen 2019-04-30
10269823 Flash memory semiconductor device Jen-Yuan Chang 2019-04-23