Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510723 | Buffer layer(s) on a stacked structure having a via | Cheng-Yuan Tsai, Yeur-Luen Tu, Chia-Shiung Tsai | 2019-12-17 |
| 10269701 | Semiconductor structure with ultra thick metal and manufacturing method thereof | Cheng-Yuan Tsai, Ching-Chung Hsu, Chung-Long Chang | 2019-04-23 |