Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453811 | Post passivation interconnect and fabrication method therefor | Yi-An Lin, C. C. Chang, Yu-Lung Shih | 2019-10-22 |
| 10290596 | Semiconductor device having a passivation layer and method of making the same | Yu-Lung Shih, Chao-Keng Li, C. C. Chang, Yi-An Lin | 2019-05-14 |