Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312183 | Die package component with jumper structure | Reyn Qin, Lucy Fan, Xiaoli Wang | 2019-06-04 |
| 10297535 | Die package component with jumper structure and manufacturing method thereof | Reyn Qin, Lucy Fan, Xiaoli Wang | 2019-05-21 |