Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10383232 | Thermoformed plastic cover for electronics and related method of manufacture | Mikko Heikkinen, Jarmo Sääski | 2019-08-13 |
| 10248277 | Multilayer structure with embedded multilayer electronics | Jarmo Sääski, Pasi Raappana, Mikko Heikkinen | 2019-04-02 |