Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10340909 | Buffer circuit and semiconductor device | — | 2019-07-02 |
| 10290756 | Multilayer structure, device using the same, method for producing the multilayer structure, and method for producing the device | Masakazu Nakaya, Noboru Higashida, Ryoichi Sasaki, Manabu Shibata, Tatsuya Oshita | 2019-05-14 |
| 10273379 | Multilayer structure and method for producing same | Ryoichi Sasaki, Mamoru Omoda, Masakazu Nakaya, Hiroyuki Ogi | 2019-04-30 |
| 10265935 | Product comprising packaging material comprising multilayer structure | Ryoichi Sasaki, Mamoru Omoda, Masakazu Nakaya, Hiroyuki Ogi | 2019-04-23 |