Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10427932 | Hermetically sealed MEMS device and its fabrication | John Charles Ehmke | 2019-10-01 |
| 10392246 | Through-substrate conductor support | John Charles Ehmke | 2019-08-27 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10427932 | Hermetically sealed MEMS device and its fabrication | John Charles Ehmke | 2019-10-01 |
| 10392246 | Through-substrate conductor support | John Charles Ehmke | 2019-08-27 |