Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410884 | Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrate | Shusaku Yanagawa, Shinji Rokuhara, Shuichi Oka | 2019-09-10 |
| 10256117 | Manufacturing method and wiring substrate with through electrode | Shusaku Yanagawa, Hiroshi Ozaki | 2019-04-09 |