Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461025 | Low cost metallization during fabrication of an integrated circuit (IC) | Boris Gedzberg, Ronald L. Michels | 2019-10-29 |
| 10347591 | Metallic, tunable thin film stress compensation for epitaxial wafers | Jeffrey Bellotti | 2019-07-09 |
| 10199324 | Low cost metallization during fabrication of an integrated circuit (IC) | Boris Gedzberg, Ron Michels | 2019-02-05 |