Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497671 | Semiconductor packages including chip stacks | Kyung Hwan Cho, Ga Hyun No, Yong Kuk Kim | 2019-12-03 |
| 10262972 | Semiconductor packages including stacked chips | Seung Yeop Lee | 2019-04-16 |
| 10217722 | Semiconductor packages having asymmetric chip stack structure | — | 2019-02-26 |