Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325786 | Double-sided plastic fan-out package structure having antenna and manufacturing method thereof | Yenheng Chen, Chengtar Wu, Jangshen Lin | 2019-06-18 |
| 10290515 | Wafer level chip packaging method | Yuedong Qiu | 2019-05-14 |