Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10224243 | Method of fabricating electronic package | Chang-Yi Lan, Ying-Chou Tsai | 2019-03-05 |
| 10201090 | Fabrication method of circuit structure | Ying-Chou Tsai | 2019-02-05 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10224243 | Method of fabricating electronic package | Chang-Yi Lan, Ying-Chou Tsai | 2019-03-05 |
| 10201090 | Fabrication method of circuit structure | Ying-Chou Tsai | 2019-02-05 |