Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10230152 | Electronic package and fabrication method thereof | Chih-Hsien Chiu, Chien-Cheng Lin, Tsung-Hsien Tsai, Chao-Ya Yang | 2019-03-12 |
| 10199731 | Electronic component | Chih-Hsien Chiu, Cheng-Yu Chiang | 2019-02-05 |