Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396021 | Fabrication method of layer structure for mounting semiconductor device | Yi-Feng Chang, Cheng-Jen Liu, Yi-Min Fu, Hung-Chi Chen | 2019-08-27 |
| 10236261 | Electronic package and method for fabricating the same | Yi-Feng Chang, Lung-Yuan Wang | 2019-03-19 |