Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396040 | Method for fabricating electronic package having a protruding barrier frame | Yue-Ying Jian, Wei Wang, Tsung-Ming Li, Kaun-I Cheng, Yu-De Chu | 2019-08-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396040 | Method for fabricating electronic package having a protruding barrier frame | Yue-Ying Jian, Wei Wang, Tsung-Ming Li, Kaun-I Cheng, Yu-De Chu | 2019-08-27 |