Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347774 | Electrode provided with UBM structure having a barrier layer for reducing solder diffusion into the electrode and a method for producing the same | Noriyuki Kishi, Tatsuhiro Koizumi, Hiroyuki Shiraki, Masaya Yamamoto | 2019-07-09 |