Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10420220 | Electronic assembly with a component arranged between two circuit carriers, and method for joining such an assembly | Thomas Bigl, Alexander Hensler, STEPHAN NEUGEBAUER, Stefan Pfefferlein, Jörg Strogies | 2019-09-17 |
| 10376994 | Soldering material based on Sn Ag and Cu | Hans-Jurgen Albrecht, Klaus Heinrich Georg Bartl, Werner Kruppa, Klaus Müller, Mathias Nowottnick +3 more | 2019-08-13 |