Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510649 | Interconnect substrate | Yoshihiro Kita | 2019-12-17 |
| 10398027 | Wiring board | Kazuhiro Oshima, Junji Sato, Katsuya Fukase | 2019-08-27 |
| 10340214 | Carrier base material-added wiring substrate | Junji Sato, Katsuya Fukase | 2019-07-02 |