Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388555 | Bonding apparatus and bonding method | Taito Kobayashi, Yasushi Sato | 2019-08-20 |
| 10361166 | Bonding device | Hidehiro Tazawa, Masahito Tuji | 2019-07-23 |
| 10350692 | Heater for bonding apparatus and method of cooling the same | Kohei Seyama, Yasuhiro CHIDA | 2019-07-16 |