TJ

Tengfei Jiang

University Of Texas System: 1 patents #134 of 892Top 20%
📍 Hangzhou City, FL: #5 of 6 inventorsTop 85%
Overall (2019): #248,801 of 560,194Top 45%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10170399 Capped through-silicon-vias for 3D integrated circuits Paul S. Ho 2019-01-01