Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522638 | Semiconductor chip and power module, and manufacturing method of the same | Masakazu Sagawa, Takahiro Morikawa, Motoyuki Miyata, Kan Yasui | 2019-12-31 |
| 10177069 | Heat-dissipating structure and semiconductor module using same | Takashi Naito, Motomune Kodama, Takuya Aoyagi, Shigeru Kikuchi, Takashi Nogawa +6 more | 2019-01-08 |