Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10491380 | Firmware of modular assembly system | Hongbo Qi, Jinfu Zhou, Ziwen Chen | 2019-11-26 |
| 10456699 | Modular assembly system | Meiyan Liao, Hongbo Qi, Sheng Zan, Jinfu Zhou, Yi Wang +3 more | 2019-10-29 |
| 10300399 | Modules registration and status update of modular assembly system | Hongbo Qi, Jinfu Zhou, Ziwen Chen | 2019-05-28 |