Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10173893 | Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS) | Emmanuel P. Quevy, Jeremy R. Hui, Mehrnaz Motiee | 2019-01-08 |