Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522479 | Semiconductor chip, and fabrication and packaging methods thereof | Chun Chao Fei, Po Yuan Chiang, Ya Ping Wang | 2019-12-31 |
| 10446474 | Packaging structure and fabrication method thereof | Li Jin, Chun Chao Fei, Po Yuan Chiang, Ya Ping Wang | 2019-10-15 |