Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10429509 | Molded proximity sensor | Jing-En Luan | 2019-10-01 |
| 10319670 | Package including multiple semiconductor devices | Maria Cristina Estacio, Seungwon IM | 2019-06-11 |
| 10256178 | Vertical and horizontal circuit assemblies | Romel N. Manatad, Chung-Lin Wu, Bigildis Dosdos, Erwin Ian V. Almagro, Maria Cristina Estacio | 2019-04-09 |