Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10467021 | High density multi node computer with improved efficiency, thermal control, and compute performance | Tung Nguyen, Syed Najaf Rizvi, David Nguyen, Eric R. Anderson | 2019-11-05 |