Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483125 | Semiconductor device and method for manufacturing same | Yuka INOUE, Mitsunori Fukura, Nobuyoshi Takahashi, Hisashi Yano, Yutaka Ito +1 more | 2019-11-19 |
| 10412983 | Extruded noodle and die piece for extruded noodle | Mitsuru Tanaka, Tatsuo Yamaya, Takuo Nakazeko, Shinichi Nakagawa | 2019-09-17 |