Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361148 | Leadframe with efficient heat dissipation for semiconductor device package assembly | Isao Ochiai | 2019-07-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361148 | Leadframe with efficient heat dissipation for semiconductor device package assembly | Isao Ochiai | 2019-07-23 |