Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10429438 | Integrated circuit authentication from a die material measurement | Ryan Helinski, Jason Hamlet | 2019-10-01 |
| 10217704 | Method for simultaneous modification of multiple semiconductor device features | Randy J. Shul, Jeffry J. Sniegowski, Kurt W. Larson | 2019-02-26 |