Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10436992 | Transceiver and interface for IC package | Eric Zbinden, Randall E. Musser, Jean-Marc Verdiell, Brian Vicich, Keith Guetig | 2019-10-08 |
| 10439330 | Overmolded lead frame providing contact support and impedance matching properties | Jonathan E. Buck | 2019-10-08 |