Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522522 | Package substrate comprising side pads on edge, chip stack, semiconductor package, and memory module comprising same | Hyouk Lee, Ki Hong Song, Jun Hee Jeong, Sung Sik Yun | 2019-12-31 |
| 10474192 | Wearable smart device having flexible semiconductor package mounted on a band | Hyouk Lee, Ki Hong Song, Jun Hee Jeong, Sung Sik Yun | 2019-11-12 |