Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10442034 | Wafer cutting apparatus | Kyoung-whan Oh, Yeon Woo Choi, In Hwan Kim, Won Ki Park, Ho-Youl Lee | 2019-10-15 |
| 10446525 | Semiconductor package | Won Keun Kim, Myung-Sung Kang, Gwang-sun Seo | 2019-10-15 |