Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483618 | Semiconductor package and manufacturing method thereof | Seung Wook Park, Jae Hyun Jung, Hwa Sun Lee, Seong Hun NA | 2019-11-19 |
TP
Tah Joon Park
Overall (2019): #251,082 of 560,194Top 45%
1
Patents 2019