Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475774 | Semiconductor package | Eun-Seok Song, Chan-kyung Kim | 2019-11-12 |
| 10262967 | Semiconductor packages | Eun-Seok Song | 2019-04-16 |
| 10204885 | Semiconductor package including stacked semiconductor chips electrically connected to redistribution layers | — | 2019-02-12 |