Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10217711 | Semiconductor package and manufacturing method thereof | Seong Jong CHEON | 2019-02-26 |
| 10171114 | Radio frequency switch apparatus having improved noise suppression characteristics | Seong Jong CHEON, Hyun Jin Yoo, Se-Jong Kim | 2019-01-01 |