Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10448508 | Printed circuit board and semiconductor package including the same | — | 2019-10-15 |
| 10204869 | Integrated circuit package including shielding between adjacent chips | Chan-hee Jeong, Young-Hoon Kim, In-Ku Kang, Hee-Yeol KIM | 2019-02-12 |