Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10229949 | Via structures including etch-delay structures and semiconductor devices having via plugs | Byung-Jun Park, Chang-Rok Moon, Seung-Hun Shin, Tae-Seok Oh, June-Taeg Lee | 2019-03-12 |