Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522471 | Semiconductor package and method of fabricating the same | Kyoung Lim Suk | 2019-12-31 |
| 10319650 | Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the same | Jongyoun Kim | 2019-06-11 |