Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10329142 | Wafer level package and method of manufacturing the same | Moon-chul Lee, Duck Hwan Kim, Yeong Gyu Lee, Jae Chang Lee, Tae Yoon Kim | 2019-06-25 |
KM
Kyong Bok Min
Overall (2019): #377,207 of 560,194Top 70%
1
Patents 2019