Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446506 | Wafer level package and manufacturing method thereof | Eun Tae Park, Jin-Ho Ha, Jun Woo Yong | 2019-10-15 |
| 10340204 | Semiconductor devices having through electrodes and methods for fabricating the same | Dong-Wan Kim, Dong-Sik Park | 2019-07-02 |
| 10249627 | Semiconductor device | Dong-Wan Kim, Ji Hun Kim, Jae Joon SONG, Hiroshi Takeda | 2019-04-02 |